CU3225K250G2K1【PDF 26/35 页】VARISTOR STD 250VRMS 3225 SMD

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SMD disk varistors (CU varistors)

Standard series

A further advantage of adhesion is that the components are subjected to virtually no temperature

shock at all. The curing temperatures of the adhesives are between 120 ° C and 180 ° C, typical

curing times are between 30 minutes and one hour.

The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-

tor of at least 2, as is to be expected due to the elasticity of the glued joints.

The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-

sult in electrical data different to those of soldered components. Users must pay special attention

to this in RF applications.

6

Solderability tests

Test

Standard

Test conditions

Test conditions

Criteria/ test results

Sn-Pb soldering

Pb-free soldering

Wettability

IEC

Immersion in

Immersion in

Covering of 95% of

60068-2-58 60/40 SnPb solder

using non-activated

flux at 215 ± 3 ° C

for 3 ± 0.3 s

Sn96.5Ag3.0Cu0.5

solder using non- or

low activated flux

at 245 ± 5 ° C

for 3 ± 0.3 s

end termination,

checked by visual

inspection

Leaching

IEC

Immersion in

Immersion in

No leaching of

resistance

Thermal shock

(solder shock)

60068-2-58 60/40 SnPb

solder using

mildly activated flux

without preheating

at 260 ± 5 ° C

for 10 ± 1 s

Dip soldering at

300 ° C/5 s

Sn96.5Ag3.0Cu0.5

solder using non- or

low activated flux

without preheating

at 255 ± 5 ° C

for 10 ± 1 s

Dip soldering at

300 ° C/5 s

contacts

No deterioration of

electrical parameters.

Capacitance change:

≤ ± 15%

Tests of resistance IEC

Immersion in

Immersion in

Change of varistor

to soldering heat

60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5

voltage:

for SMDs

Tests of resistance IEC

at 260 ° C

Immersion

for 10 s at 260 ° C

Immersion

≤ ± 5%

Change of varistor

to soldering heat

for radial leaded

components

(SHCV)

60068-2-20

of leads in

60/40 SnPb

for 10 s at 260 ° C

of leads in

Sn96.5Ag3.0Cu0.5

for 10 s at 260 ° C

voltage: ≤ ± 5%

Change of

capacitance X7R:

≤

5/+10%

Please read Cautions and warnings and

Important notes at the end of this document.

Page 26 of 35

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